BaiShun offers Multi-Layer Power PCBs engineered for compact, high-performance power electronics. With up to 20 layers, our boards provide efficient signal routing, power-ground separation, and optimized thermal performance—making them ideal for advanced DC-DC converters, motor drives, and embedded power modules.
Our advanced fabrication capabilities support fine-line circuitry, blind/buried vias, and custom dielectric stack-ups, enabling miniaturization without compromising current capacity or thermal management.
🔹 Applications: Industrial automation, EV power systems, telecom power modules, medical equipment
🔹 Features: High layer count (up to 20), power-ground isolation, HDI-compatible, excellent thermal and electrical reliability
